Hon'ble Chief Minister Shri Mohan Charan Majhi join Hon'ble Union Minister Shri Ashwini Vaishnaw Ji for the groundbreaking ceremony of the nation's first advanced 3D glass substrate packaging facility, a historic milestone that positions Odisha at the for

Today, from the soil of Odisha, India took a defining step in its semiconductor journey. I was delighted to join Hon'ble Union Minister Shri Ashwini Vaishnaw Ji for the groundbreaking ceremony of the nation's first advanced 3D glass substrate packaging facility, a historic milestone that positions Odisha at the forefront of global electronics manufacturing and artificial intelligence. This is not merely an industrial investment; it is a declaration of where the technologies of tomorrow will be built, and a proud testament to what responsive governance and strategic vision can deliver for our people.
This facility will generate thousands of quality jobs for our youth and anchor a thriving ecosystem of testing laboratories and ancillary industries, accelerating Odisha's transformation from a mineral-driven economy to a mind-driven one, where the brilliance of Odia talent meets world-class infrastructure. To the global technology industry, our message is clear: with abundant power, a skilled workforce, and an unwavering commitment to progress, Odisha is India's ultimate destination for advanced electronics and a truly Atmanirbhar Bharat.